Packaging and metallisation
The packaging and metallisation of an electronic device or sensor are
essential considerations in extreme conditions and environments:
- Any metal
contacts must be stable
- Package and device must be thermally compatible
- Device must be chemically stable.
MORGaN proposes a novel technological
solution to electron device and sensor modules for extreme and harsh
environments. The use of the III-Nitride material system together with
polycrystalline diamond-based substrates and nanocrystalline diamond heat
spreading layers will be studied.
Advanced 3D ceramic packaging and new metallisation techniques based on the
emerging technology of MN+1AXN alloys will also be explored.
Layer techniques may be used to manufacture very complex geometrical structures,
so in principle any structure could be manufactured in ceramics and metals.
MORGaN will develop new ceramics and metal system for high temperature
Layer-manufactured ceramics platform, with embedded 3D interconnects
||Gyro holder with printed